Press Release

5 November 2003

 

New Miniature Package With Advanced Structure
- New Platform Oscillators (NPO) -

 

Singapore, 5 November 2003 – EPSON announces the development of a completely new type of highly compact package.

This new package combines EPSON's original plastic molding technology with its knowledge in building ultra-compact crystals in ceramic package. The internal structure is similar to regular ICs where the semiconductor chip is attached via a lead frame. In case of the “New Platform Oscillator” (NPO) a crystal in a ceramic package is additionally attached to the same lead frame. An advanced wire bonding process reassures high reliability. The whole structure provides significant resistance against stress-generated frequency changes. This creates a clear advantage over oscillators in ceramic package, which have become popular on the market.

Another advantage is the temperature extension coefficient of the plastic mold package. It is a measure for size changes over temperature shifts. As in case of the EPSON NPO it is very similar to that of a PCB, different to ceramic packages, problems with soldering will belong to the past.

Thus the NPO technology enables EPSON to offer ultra compact and highly reliable quartz devices. Oscillators in a 5 x 3.2 mm package will be the first products available. In the following there will be oscillators in 3.2 x 2.5 mm and smaller. Also Real Time Clock Modules (RTC) with the same structure will appear in the very near future. With this new package type EPSON delivers yet another proof of its technology leadership on the quartz market.
 

EPSON SINGAPORE PTE LTD is a wholly owned subsidiary of SEIKO EPSON CORPORATION, Japan. As the Regional Headquarters of SEIKO EPSON CORPORATION, EPSON SINGAPORE PTE LTD handles sales and marketing of information-related equipment such as printers, scanners and projectors, electronic devices including semiconductors, LCDs and crystal devices, and system devices in Singapore, Malaysia, Thailand, Indonesia, Philippines, India, Australia and New Zealand.

More information about EPSON SINGAPORE PTE LTD is available at http://www.epson.com.sg/html/electronic_devices.html

Further Information:

        EPSON SINGAPORE PTE LTD
        ED Division
        Luvinna Lew / Chan Tuck Mun

        Add:

        401, Commonwealth Drive, #07-01

         

        Haw Par Technocentre

         

        Singapore 149598

        Tel: 

        +65 6 586 3100

        Fax:

        +65 6 472 4291

        E-mail: 

        mailto:ed-sales@esp.epson.com.sg